DUAL OVENABLE FOOD PACKAGE HAVING A THERMOFORMABLE POLYESTER FILM LID

The invention provides an ovenable vacuum skin package for storage and cooking of a food product. The package includes a receptacle and a thermoformable composite polymeric film cover heat-sealed thereto, and the composite polymeric film cover includes: (i) a thermoformable substrate layer comprisin...

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Bibliographische Detailangaben
Hauptverfasser:	DENG, FENGHUA, FRANZYSHEN, STEPHEN, K
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING GENERAL PROCESSES OF COMPOUNDING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The invention provides an ovenable vacuum skin package for storage and cooking of a food product. The package includes a receptacle and a thermoformable composite polymeric film cover heat-sealed thereto, and the composite polymeric film cover includes: (i) a thermoformable substrate layer comprising a first copolyester material; and (ii) on a surface of the substrate layer, a heat-sealable layer comprising a second copolyester material, the second copolyester material being different from the first copolyester material; wherein i. the receptacle comprises on a surface thereof a sealing region adapted to contact and form a seal with the heat-sealable layer; and ii. both the receptacle and the cover film comply with the requirements of paragraph h(1) of 21 CFR § 177.1630. L'invention concerne un emballage par film sous vide allant au four pour le stockage et la cuisson d'un produit alimentaire. L'emballage comprend un récipient et un couvercle en film polymère composite thermoformable thermoscellé sur le récipient. Le couvercle en film polymère composite comprend : (i) une couche de substrat thermoformable comprenant un premier matériau en copolyester ; et (ii) sur une surface de la couche de substrat, une couche thermoscellable comprenant un second matériau en copolyester, le second matériau en copolyester étant différent du premier matériau en copolyester. i) Le réceptacle comprend sur une de ses surfaces une région d'étanchéité adaptée pour venir en contact avec la couche thermoscellable et à assurer l'étanchéité de celle-ci. ii) Aussi bien le récipient que le film du couvercle sont conformes aux exigences du paragraphe h(1) de la norme 21 CFR par. 177.1630.