WAFER RECLAMATION COMPOSITIONS AND METHODS
Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition preferably includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not dam...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KORZENSKI, MICHAEL JIANG, PING HAN, JIANWEN LIU, JUN MINSEK, DAVID VISINTIN, PAMELA ZHOU, RENJIE HILGARTH, MONICA KING, MACKENZIE |
| description | Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition preferably includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and/or reuse of said structure. Processes include the monitoring and modifying said compositions.
L'invention concerne des compositions et procédés d'enlèvement destinés à enlever au moins une couche de matériau à partir d'une structure du dispositif micro-électronique rejetée ayant celle-ci dessus. La composition d'enlèvement comprend de préférence de l'acide fluorhydrique. La composition obtient un enlèvement important d'huile ou de matériau(x) devant être enlevé(s) sans détériorer les couches devant être retenues, pour récupérer, réusiner, recycler et/ou réutiliser la structure. Les procédés comprennent la surveillance et la modification des compositions. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2008157345A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2008157345A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2008157345A23</originalsourceid><addsrcrecordid>eNrjZNAKd3RzDVIIcnX2cfR1DPH091Nw9vcN8A_2BLGDFRz9XBR8XUM8_F2CeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGBhaGpubGJqaORMXGqAPLGJbs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WAFER RECLAMATION COMPOSITIONS AND METHODS</title><source>esp@cenet</source><creator>KORZENSKI, MICHAEL ; JIANG, PING ; HAN, JIANWEN ; LIU, JUN ; MINSEK, DAVID ; VISINTIN, PAMELA ; ZHOU, RENJIE ; HILGARTH, MONICA ; KING, MACKENZIE</creator><creatorcontrib>KORZENSKI, MICHAEL ; JIANG, PING ; HAN, JIANWEN ; LIU, JUN ; MINSEK, DAVID ; VISINTIN, PAMELA ; ZHOU, RENJIE ; HILGARTH, MONICA ; KING, MACKENZIE</creatorcontrib><description>Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition preferably includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and/or reuse of said structure. Processes include the monitoring and modifying said compositions.
L'invention concerne des compositions et procédés d'enlèvement destinés à enlever au moins une couche de matériau à partir d'une structure du dispositif micro-électronique rejetée ayant celle-ci dessus. La composition d'enlèvement comprend de préférence de l'acide fluorhydrique. La composition obtient un enlèvement important d'huile ou de matériau(x) devant être enlevé(s) sans détériorer les couches devant être retenues, pour récupérer, réusiner, recycler et/ou réutiliser la structure. Les procédés comprennent la surveillance et la modification des compositions.</description><language>eng ; fre</language><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CANDLES ; CHEMISTRY ; CINEMATOGRAPHY ; DETERGENT COMPOSITIONS ; DETERGENTS ; ELECTROGRAPHY ; FATTY ACIDS THEREFROM ; HOLOGRAPHY ; MATERIALS THEREFOR ; METALLURGY ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; RECOVERY OF GLYCEROL ; RESIN SOAPS ; SOAP OR SOAP-MAKING ; USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081224&DB=EPODOC&CC=WO&NR=2008157345A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081224&DB=EPODOC&CC=WO&NR=2008157345A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KORZENSKI, MICHAEL</creatorcontrib><creatorcontrib>JIANG, PING</creatorcontrib><creatorcontrib>HAN, JIANWEN</creatorcontrib><creatorcontrib>LIU, JUN</creatorcontrib><creatorcontrib>MINSEK, DAVID</creatorcontrib><creatorcontrib>VISINTIN, PAMELA</creatorcontrib><creatorcontrib>ZHOU, RENJIE</creatorcontrib><creatorcontrib>HILGARTH, MONICA</creatorcontrib><creatorcontrib>KING, MACKENZIE</creatorcontrib><title>WAFER RECLAMATION COMPOSITIONS AND METHODS</title><description>Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition preferably includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and/or reuse of said structure. Processes include the monitoring and modifying said compositions.
L'invention concerne des compositions et procédés d'enlèvement destinés à enlever au moins une couche de matériau à partir d'une structure du dispositif micro-électronique rejetée ayant celle-ci dessus. La composition d'enlèvement comprend de préférence de l'acide fluorhydrique. La composition obtient un enlèvement important d'huile ou de matériau(x) devant être enlevé(s) sans détériorer les couches devant être retenues, pour récupérer, réusiner, recycler et/ou réutiliser la structure. Les procédés comprennent la surveillance et la modification des compositions.</description><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CANDLES</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>DETERGENT COMPOSITIONS</subject><subject>DETERGENTS</subject><subject>ELECTROGRAPHY</subject><subject>FATTY ACIDS THEREFROM</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>RECOVERY OF GLYCEROL</subject><subject>RESIN SOAPS</subject><subject>SOAP OR SOAP-MAKING</subject><subject>USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKd3RzDVIIcnX2cfR1DPH091Nw9vcN8A_2BLGDFRz9XBR8XUM8_F2CeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGBhaGpubGJqaORMXGqAPLGJbs</recordid><startdate>20081224</startdate><enddate>20081224</enddate><creator>KORZENSKI, MICHAEL</creator><creator>JIANG, PING</creator><creator>HAN, JIANWEN</creator><creator>LIU, JUN</creator><creator>MINSEK, DAVID</creator><creator>VISINTIN, PAMELA</creator><creator>ZHOU, RENJIE</creator><creator>HILGARTH, MONICA</creator><creator>KING, MACKENZIE</creator><scope>EVB</scope></search><sort><creationdate>20081224</creationdate><title>WAFER RECLAMATION COMPOSITIONS AND METHODS</title><author>KORZENSKI, MICHAEL ; JIANG, PING ; HAN, JIANWEN ; LIU, JUN ; MINSEK, DAVID ; VISINTIN, PAMELA ; ZHOU, RENJIE ; HILGARTH, MONICA ; KING, MACKENZIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2008157345A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2008</creationdate><topic>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CANDLES</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>DETERGENT COMPOSITIONS</topic><topic>DETERGENTS</topic><topic>ELECTROGRAPHY</topic><topic>FATTY ACIDS THEREFROM</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>RECOVERY OF GLYCEROL</topic><topic>RESIN SOAPS</topic><topic>SOAP OR SOAP-MAKING</topic><topic>USE OF SINGLE SUBSTANCES AS DETERGENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KORZENSKI, MICHAEL</creatorcontrib><creatorcontrib>JIANG, PING</creatorcontrib><creatorcontrib>HAN, JIANWEN</creatorcontrib><creatorcontrib>LIU, JUN</creatorcontrib><creatorcontrib>MINSEK, DAVID</creatorcontrib><creatorcontrib>VISINTIN, PAMELA</creatorcontrib><creatorcontrib>ZHOU, RENJIE</creatorcontrib><creatorcontrib>HILGARTH, MONICA</creatorcontrib><creatorcontrib>KING, MACKENZIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KORZENSKI, MICHAEL</au><au>JIANG, PING</au><au>HAN, JIANWEN</au><au>LIU, JUN</au><au>MINSEK, DAVID</au><au>VISINTIN, PAMELA</au><au>ZHOU, RENJIE</au><au>HILGARTH, MONICA</au><au>KING, MACKENZIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER RECLAMATION COMPOSITIONS AND METHODS</title><date>2008-12-24</date><risdate>2008</risdate><abstract>Removal compositions and processes for removing at least one material layer from a rejected microelectronic device structure having same thereon. The removal composition preferably includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and/or reuse of said structure. Processes include the monitoring and modifying said compositions.
L'invention concerne des compositions et procédés d'enlèvement destinés à enlever au moins une couche de matériau à partir d'une structure du dispositif micro-électronique rejetée ayant celle-ci dessus. La composition d'enlèvement comprend de préférence de l'acide fluorhydrique. La composition obtient un enlèvement important d'huile ou de matériau(x) devant être enlevé(s) sans détériorer les couches devant être retenues, pour récupérer, réusiner, recycler et/ou réutiliser la structure. Les procédés comprennent la surveillance et la modification des compositions.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2008157345A2 |
| source | esp@cenet |
| subjects | ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS |
| title | WAFER RECLAMATION COMPOSITIONS AND METHODS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T17%3A56%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KORZENSKI,%20MICHAEL&rft.date=2008-12-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2008157345A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |