METHOD FOR APPLYING A THIN-FILM ENCAPSULATION LAYER ASSEMBLY TO AN ORGANIC DEVICE, AND AN ORGANIC DEVICE PROVIDED WITH A THIN-FILM ENCAPSULATION LAYER ASSEMBLY PREFERABLY APPLIED WITH SUCH A METHOD

A method for applying a thin-film encapsulation layer assembly to an organic device, which comprises a substrate which is provided with an active stack and is then provided with the thin-film encapsulation layer assembly for screening the active stack substantially from oxygen and moisture, wherein...

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Bibliographische Detailangaben

Hauptverfasser:	VAN RENS, BAS JAN EMILE, LANGE, RUEDIGER, CROONEN, YVO HENDRIK
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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