COOLING SHIELD FOR SUBSTRATE PROCESSING CHAMBER

A process kit comprises an upper shield to encircle a sputtering target in a substrate processing chamber, to reduce deposition of process deposits on the chamber components and the overhanging edge of the substrate. The shield described is of unitary construction with a top ring, support ledge and...

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Bibliographische Detailangaben
Hauptverfasser:	PAVLOFF, CRISTOPHER MARK, SCHEIBLE, KATHLEEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A process kit comprises an upper shield to encircle a sputtering target in a substrate processing chamber, to reduce deposition of process deposits on the chamber components and the overhanging edge of the substrate. The shield described is of unitary construction with a top ring, support ledge and cylindrical band having a plurality of steps. Un kit de procédé comprend un écran supérieur pour entourer une cible de pulvérisation dans une chambre de traitement de substrats, afin de réduire la formation de dépôts dus au procédé sur les éléments composant la chambre et le rebord en surplomb du substrat. L'écran décrit est une construction monobloc munie d'une bague supérieure, d'un rebord support et d'une bande cylindrique présentant une pluralité d'échelons.