METHOD AND APPARATUS FOR TESTING SYSTEM-IN-PACKAGE DEVICES, MICRO SD DEVICES

A method for testing system-in package devices (105) with a plurality of electric leads includes: placing the system-in-package devices (105) on a JEDEC load tray (101), forming a load tray stack, determining the direction of the load tray, providing a test holder (1300) with test circuits which cor...

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Hauptverfasser:	COSTELLO, MICHAEL PETER, CHEN, CHING TOO, HOPKINS, JAMES E, TSAI, ICHING
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A method for testing system-in package devices (105) with a plurality of electric leads includes: placing the system-in-package devices (105) on a JEDEC load tray (101), forming a load tray stack, determining the direction of the load tray, providing a test holder (1300) with test circuits which correspond to the number of collecting slots (103) and provide a plurality of test joint groups, moving the load tray (101) so as to achieve synchronously the electric connection between each group of said test joint groups and said electric lead of corresponding group of the system-in package devices (105) which are placed in said collecting slots (103) and test synchronously. L'invention concerne un procédé pour tester des dispositifs de système en boîtier (105) avec plusieurs conducteurs électriques, le procédé comprenant les opérations consistant à : placer les dispositifs de système en boîtier (105) sur un plateau de chargement JEDEC (101), former une pile de plateaux de chargement, déterminer la direction du pla