CONDUCTIVE VIA FORMATION UTILIZING ELECTROPLATING

A method for forming a conductive via is discussed and includes forming a seed layer over a first side (125) of a semiconductor substrate (103), wherein the semiconductor substrate includes a first side opposite a second side (127), forming a via hole (329) in a semiconductor substrate from the seco...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JONES, ROBERT E, SPARKS, TERRY G
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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