METHOD OF MANUFACTURING OF ELECTRONICS PACKAGE

A method for manufacturing an electronics package is provided in which a carrier is provided, at least one electronic component is placed on the carrier and a base layer is then deposited on the electronic component(s). The base layer may include a dielectric layer binding the electronic component(s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAENTYSALO, MATTI, MOLKKARI, PETRI, MIETTINEN, JANI, VALTANEN, JANI, MANSIKKAMAEKI, PAULINA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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