STACKED FLIP-ASSEMBLED SEMICONDUCTOR CHIPS EMBEDDED IN THIN HYBRID SUBSTRATE

A semiconductor system having a substrate (101) including a rigid insulating interposer (110) with a high modulus and a top (140) and a bottom (150) low-modulus tape with flip-attached semiconductor chips (120, 130). The assembled chips, with the passive surfaces facing each other, are located in an...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	DUNNE, RAJIV, CARL
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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