SUBMOUNT FOR ELECTRONIC COMPONENTS

A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SNIJDER, PIETER, J, ZAINZINGER, ERICH, VAN PIETERSON, LIESBETH, BHATTACHARYA, RABIN
Format: Patent
Sprache:eng ; fre
Schlagworte:
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