HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS
Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperatu...
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| Format: | Patent |
| Sprache: | eng ; fre |
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