PRINTED CIRCUIT BOARDS FOR HIGH-SPEED COMMUNICATION
Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible conductors.
La présente invention concerne un appareil et un procédé pour communiquer des signaux haut débit entre une carte à circuit imprimé principale et une ou plusieurs cartes à circuit imprimé secondaires. Les signaux haut débit sont communiqués entre les cartes à circuit imprimé principales et les cartes à circuit imprimé secondaires via des conducteurs flexibles multicouches. |
---|