PRINTED CIRCUIT BOARDS FOR HIGH-SPEED COMMUNICATION

Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOMBAERDE, ROBERT, PHAN, CHINH, Q, SHAH, JIGNESH, H
Format: Patent
Sprache:eng ; fre
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Beschreibung
Zusammenfassung:Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible conductors. La présente invention concerne un appareil et un procédé pour communiquer des signaux haut débit entre une carte à circuit imprimé principale et une ou plusieurs cartes à circuit imprimé secondaires. Les signaux haut débit sont communiqués entre les cartes à circuit imprimé principales et les cartes à circuit imprimé secondaires via des conducteurs flexibles multicouches.