THERMALLY CONDUCTIVE GREASE AND METHODS AND DEVICES IN WHICH SAID GREASE IS USED

A grease includes: (A) 2 to 50 weight %, based on the weight of the grease, of a polyorganosiloxane having an average, per molecule, of at least one silicon-bonded hydrocarbonoxy-functional group; and (B) 50 to 98 weight %, based on the weight of the grease, of at least one thermally conductive fill...

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Bibliographische Detailangaben
Hauptverfasser:	FISHER, MARK, LIN, ZUCHEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUELS LUBRICANTS LUBRICATING COMPOSITIONS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PEAT PETROLEUM, GAS OR COKE INDUSTRIES POLISHES SEMICONDUCTOR DEVICES TECHNICAL GASES CONTAINING CARBON MONOXIDE THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A grease includes: (A) 2 to 50 weight %, based on the weight of the grease, of a polyorganosiloxane having an average, per molecule, of at least one silicon-bonded hydrocarbonoxy-functional group; and (B) 50 to 98 weight %, based on the weight of the grease, of at least one thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from electronic devices. L'invention concerne une graisse comprenant : (A) de 2 à 50 % en poids, par rapport au poids de la graisse, d'un polyorganosiloxane ayant en moyenne, par molécule, au moins un groupement fonctionnel hydrocarbonoxy lié par un silicium ; et (B) de 50 à 98 % en poids, par rapport au poids de la graisse, d'au moins une charge conductrice thermiquement. La graisse peut être utilisée en tant que matériau d'interface thermique pour dissiper la chaleur issue de dispositifs électroniques.