MULTI-CHIP ELECTRONIC PACKEGE

An electronic component (10) comprises lead fingers (2) and a die paddle (4) . A tape pad (1) is mounted below the lead fingers (2) and the die paddle (4) . A first semiconductor chip (3) is bonded onto the tape pad (1) by a layer of first adhesive (8) and a second semiconductor chip (5) is bonded onto the die paddle (4) by a layer of second adhesive (7) . Electrical contacts (11) are provided between the contact areas of the semiconductors (3) and (5) , and the lead fingers (2) . An encapsulating compound covers part of the lead fingers (2), the tape pad (1) , the semiconductor chips (3) and (5) and the electrical contacts (11) . An electronic component (10) comprises lead fingers (2) and a die paddle (4) . A tape pad (1) is mounted below the lead fingers (2) and the die paddle (4) . A first semiconductor chip (3) is bonded onto the tape pad (1) by a layer of first adhesive (8) and a second semiconductor chip (5) is bonded onto the die paddle (4) by a layer of second adhesive (7) . Electrical contacts (11) are provided between the contact areas of the semiconductors (3) and (5) , and the lead fingers (2) . An encapsulating compound covers part of the lead fingers (2), the tape pad (1) , the semiconductor chips (3) and (5) and the electrical contacts (11) .