SEMICONDUCTOR PACKAGE WITH PLATED CONNECTION

A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards...

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Bibliographische Detailangaben

Hauptverfasser:	LIU, KAI, LUO, LEESHAWN, ZHANG, XIAO, TIANG, SUN, MING
Format:	Patent
Sprache:	eng ; fre
Online-Zugang:	Volltext bestellen
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