WAVEFRONT ANALYSIS METHOD INVOLVING MULTILATERAL INTERFEROMETRY WITH FREQUENCY DIFFERENCE

The invention relates to a wavefront analysis method involving multilateral interferometry with frequency difference. According to the invention, a diffraction grating (GR) with two-dimensional meshing is placed on the path of the beam to be analysed and at least two interferograms with at least two...

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Bibliographische Detailangaben
Hauptverfasser:	TAUVY, MICHEL, GUERINEAU, NICOLAS, HAIDAR, RIAD, PRIMOT, JEROME, VELGHE, SABRINA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	COLORIMETRY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS RADIATION PYROMETRY TESTING
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Beschreibung
Zusammenfassung:	The invention relates to a wavefront analysis method involving multilateral interferometry with frequency difference. According to the invention, a diffraction grating (GR) with two-dimensional meshing is placed on the path of the beam to be analysed and at least two interferograms with at least two different colours are processed, each interferogram being obtained in a plane (Ps)from two sub-beams (R1, R2) with different diffraction orders. The invention can be used to analyse and correct sheared wavefronts (S). Le procédé consiste à placer un réseau de diffraction GR à maillage bidimensionnel sur le trajet du faisceau à analyser et à traiter au moins deux interférogrammes à au moins deux couleurs différentes, chaque interférogramme étant obtenu dans un plan Psà partir de deux sous- faisceaux Rl, R2 d'ordres de diffraction différents. Application à l'analyse et à la correction de surfaces d'onde morcelées S.