A METHOD FOR LASER TREATMENT OF IMPLANTABLE DEVICES, IMPLANTABLE DEVICES OBTAINED USING SAID METHOD, AND A LASER SYSTEM FOR TREATMENT OF IMPLANTABLE DEVICES

Method for the laser treatment of implantable devices comprising the step of treating a surface of the implantable device (1) via a diode-pumped solid-state laser (DPSS) in Q-switch regime for creating on the device itself a surface morphology comprising a controlled distribution of pores (5) having...

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Hauptverfasser: D'ANTUONI, DOMENICO, GALLUS, ENRICO, DI NARDA, FRANCESCA
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Sprache:eng ; fre
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creator D'ANTUONI, DOMENICO
GALLUS, ENRICO
DI NARDA, FRANCESCA
description Method for the laser treatment of implantable devices comprising the step of treating a surface of the implantable device (1) via a diode-pumped solid-state laser (DPSS) in Q-switch regime for creating on the device itself a surface morphology comprising a controlled distribution of pores (5) having a diameter and depth of between 3 and 150 µm and preferably 5-20 µm, and a pitch of between 5 and 300 µm and preferably between 10 and 30 µm. La présente invention concerne un procédé pour le traitement au laser de dispositifs implantables comprenant l'étape consistant à traiter une surface du dispositif implantable (1) par le biais d'un laser à solide à pompage par diode (DPSS) dans un régime de laser déclenché afin de créer sur le dispositif même une morphologie de surface comprenant une distribution contrôlée de pores (5) ayant un diamètre et une profondeur entre 3 et 150 µm et préférablement de 5 à 20 µm, et un pas entre 5 et 300 µm et préférablement entre 10 et 30 µm.
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La présente invention concerne un procédé pour le traitement au laser de dispositifs implantables comprenant l'étape consistant à traiter une surface du dispositif implantable (1) par le biais d'un laser à solide à pompage par diode (DPSS) dans un régime de laser déclenché afin de créer sur le dispositif même une morphologie de surface comprenant une distribution contrôlée de pores (5) ayant un diamètre et une profondeur entre 3 et 150 µm et préférablement de 5 à 20 µm, et un pas entre 5 et 300 µm et préférablement entre 10 et 30 µm.</description><language>eng ; fre</language><subject>APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE ; BANDAGES, DRESSINGS OR ABSORBENT PADS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DENTISTRY ; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. 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subjects APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
BANDAGES, DRESSINGS OR ABSORBENT PADS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DENTISTRY
DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. STENTS
FILTERS IMPLANTABLE INTO BLOOD VESSELS
FIRST-AID KITS
FOMENTATION
HUMAN NECESSITIES
HYGIENE
MACHINE TOOLS
MEDICAL OR VETERINARY SCIENCE
METAL-WORKING NOT OTHERWISE PROVIDED FOR
ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES
PERFORMING OPERATIONS
PROSTHESES
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OR PROTECTION OF EYES OR EARS
WELDING
WORKING BY LASER BEAM
title A METHOD FOR LASER TREATMENT OF IMPLANTABLE DEVICES, IMPLANTABLE DEVICES OBTAINED USING SAID METHOD, AND A LASER SYSTEM FOR TREATMENT OF IMPLANTABLE DEVICES
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