SEMICONDUCTOR DIE ASSEMBLY

The invention is based on the discovery that certain well-defined b-stageable adhesives are useful in stacked die assemblies. In particular, the invention provides assemblies wherein the b-stageable adhesive encapsulates a portion of the wiring members contained within the bondline gap between the s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GATTUSO, MARIO, FORRAY, DEBBIE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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