MICROFEATURE ASSEMBLIES INCLUDING INTERCONNECT STRUCTURES AND METHODS FOR FORMING SUCH INTERCONNECT STRUCTURES

Microfeature assemblies including interconnect structures and. methods for forming such interconnect structures are disclosed herein. One particular embodiment of a microfeature assembly includes a microelectronic die (210) having integrated circuitry (211), a plurality of terminals (212) electrical...

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Bibliographische Detailangaben

1. Verfasser:	PUAH, KIA, HENG
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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