SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

A substrate processing apparatus is provided with a plurality of process chambers for performing prescribed processing to a substrate to be processed, and a common transfer chamber (102) which is commonly connected to the process chambers and carries in and out the substrates to and from the process...

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Bibliographische Detailangaben
Hauptverfasser:	HERAI, TAKEBU, YASUHARA, MOYURU, KANEMARU, HIDETADA
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A substrate processing apparatus is provided with a plurality of process chambers for performing prescribed processing to a substrate to be processed, and a common transfer chamber (102) which is commonly connected to the process chambers and carries in and out the substrates to and from the process chambers, respectively. The process chambers include adhered material removing process chambers (104A, 104B) for removing an adhered material including a native oxide adhered on the substrate by chemical reaction with a gas component not using plasma and heat treatment; film forming process chambers (104C, 104D) for forming a film on the substrate; and a measuring process chamber (400) for measuring the substrate. La présente invention concerne un appareil de traitement de substrat qui est équipé d'une pluralité de chambres de traitement destinées à réaliser un traitement prescrit sur un substrat devant être traité, ainsi qu'une chambre de transfert commune (102) qui est communément raccordée aux chambres de traitement et fait entrer et sortir les substrats dans et à partir des chambres de traitement, respectivement. Les chambres de traitement comprennent des chambres de traitement d'élimination d'un matériau ayant adhéré (104A, 104B) destinées à éliminer un matériau ayant adhéré comprenant un oxyde natif ayant adhéré au substrat par une réaction chimique avec un composant gazeux sans utiliser de plasma ni de traitement thermique ; des chambres de traitement de formation de film (104C, 104D) destinées à former un film sur le substrat ; et une chambre de traitement de mesure (400) destinée à mesurer le substrat.