WAFER INSPECTION SYSTEM AND A METHOD FOR TRANSLATING WAFERS

A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shap...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VANO, MOSHIK, VAINER, MICHAEL, GILEAD, AMIR, NISANY, ITZIK, NUZNI, VALERY
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
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