ATMOSPHERIC PROCESS AND SYSTEM FOR CONTROLLED AND RAPID REMOVAL OF POLYMERS FROM HIGH ASPECT RATIO HOLES

A system that generates an intense hot gas stream is described to etch a polymer on a substrate used in the manufacture of semiconductor and MEMS devices with no surface damage. The etching process is particularly useful to remove a polymer from relatively high aspect Height-to-Width and Width-to-He...

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Bibliographische Detailangaben
Hauptverfasser: TOKMOULINE, ISKANDER, BOLLINGER, LYNN, DAVID
Format: Patent
Sprache:eng ; fre
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