SEMICONDUCTOR WAFER CUTTING BLADE AND METHOD

The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs approximately coinciding with the peripheries of numerous devices ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HARRIS, JOHN, PAUL, JR
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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