RFID LABEL ASSEMBLY

An RFID label is bonded to the surface of a plastic container. The label includes a web of label stock having an antenna and an RFID chip on the reverse side of the label. The antenna and the chip are between ihe label and the container. The obverse side of the label is visible on the exterior of th...

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Bibliographische Detailangaben
Hauptverfasser:	PARKER, BRIAN, G, AMMOND, P., CHARLES
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CALCULATING COMPUTING CONVEYING COUNTING DETECTING MASSES OR OBJECTS GATHERING OR REMOVAL OF DOMESTIC OR LIKE REFUSE GEOPHYSICS GRAVITATIONAL MEASUREMENTS HANDLING RECORD CARRIERS HANDLING THIN OR FILAMENTARY MATERIAL INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MEASURING PACKING PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STORING TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An RFID label is bonded to the surface of a plastic container. The label includes a web of label stock having an antenna and an RFID chip on the reverse side of the label. The antenna and the chip are between ihe label and the container. The obverse side of the label is visible on the exterior of the container and includes printed material such as a barcode. A protective patch may overlie the RFID chip to protect the RFID chip from the molten polymer during the molding process. Une étiquette RFID est collée sur la surface d'un récipient de plastique. Cette étiquette comprend une bande d'étiquette de stock possédant une antenne et une puce RFID sur le recto de cette étiquette. L'antenne et la puce sont situées entre l'étiquette et le récipient. Le recto de l'étiquette est visible sur l'extérieur du récipient et comprend un document imprimé tel qu'un code-barre. Un timbre de protection peut recouvrir la puce RFID de façon à protéger cette puce RFID du polymère fondu pendant le processus de moulage.