POLISHING SLURRY

The present invention discloses a polishing slurry, wherein, the said polishing slurry contains polishing abrasive grains and a carrier, it further contains a reagent which has two functional groups. The polishing slurry of the present invention can reduce the concentration of the abrasive grains in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIAO, DANNY, ZHENGLONG, YANG, ANDY, CHUNXIAO
Format: Patent
Sprache:chi ; eng ; fre
Schlagworte:
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