POLISHING SLURRY
The present invention discloses a polishing slurry, wherein, the said polishing slurry contains polishing abrasive grains and a carrier, it further contains a reagent which has two functional groups. The polishing slurry of the present invention can reduce the concentration of the abrasive grains in...
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Format: | Patent |
Sprache: | chi ; eng ; fre |
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