LEAD FRAME PANEL AND A PLURALITY OF HALF-ETCHED CONNECTION BARS

A lead frame panel (40) includes a body (42) having an array of die support areas (44) for receiving respective semiconductor dies. The die support areas (44) are surrounded by leads (46). Adjacent rows of leads are coupled by half-etched connection bars (48), such that each half-etched portion of t...

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Bibliographische Detailangaben
Hauptverfasser:	LAI, GOR AMIE, WONG, FEI YING, SHIU, HEI MING
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A lead frame panel (40) includes a body (42) having an array of die support areas (44) for receiving respective semiconductor dies. The die support areas (44) are surrounded by leads (46). Adjacent rows of leads are coupled by half-etched connection bars (48), such that each half-etched portion of the connection bars (48) forms a channel into which a mold compound (54) is injected. Un panneau à cadre de montage (40) comprend un corps (42) possédant un réseau de zones de support de matrice (44) pour les matrices semi-conductrices correspondantes. Les zones de support de matrice (44) sont entourées par des conducteurs (46). Des rangées de conducteurs adjacents sont couplées par des barres de connexion à moitié gravées (48), de manière à ce que chacune des parties barres de connexion à moitié gravées (48) forme un canal dans lequel un composé de moulage (54) est injecté.