METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a conductive material from a substrate surface including one or more inorganic acids, a pH adjusting agent, a chelating agent, a...

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Bibliographische Detailangaben
Hauptverfasser:	MAO, DAXIN, JIA, RENHE, CHEN, LIANG-YUH, TSAI, STAN D, KARUPPIAH, LAKSH, ZHAO, JUNZI
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES SKI WAXES
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