COAT/DEVELOP MODULE WITH SHARED DISPENSE
An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central flu...
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| creator | ROBERTS, RICK, J ISHIKAWA, TETSUYA |
| description | An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
Cette invention concerne un dispositif de distribution de fluide au cours d'opérations de traitement sur un substrat semi-conducteur. Le dispositif comprend un banc central de distribution de fluide comprenant une pluralité de buses reliées à une pluralité de sources de fluide et une première chambre de traitement disposée sur un premier côté dudit banc. Le dispositif comprend également une seconde chambre de distribution disposée sur un second côté de ce même banc et un bras de distribution conçu pour se déplacer entre le banc central de distribution de fluide, la première chambre de traitement et la seconde chambre de traitement. |
| format | Patent |
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Cette invention concerne un dispositif de distribution de fluide au cours d'opérations de traitement sur un substrat semi-conducteur. Le dispositif comprend un banc central de distribution de fluide comprenant une pluralité de buses reliées à une pluralité de sources de fluide et une première chambre de traitement disposée sur un premier côté dudit banc. Le dispositif comprend également une seconde chambre de distribution disposée sur un second côté de ce même banc et un bras de distribution conçu pour se déplacer entre le banc central de distribution de fluide, la première chambre de traitement et la seconde chambre de traitement.</description><language>eng ; fre</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060629&DB=EPODOC&CC=WO&NR=2006069348A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060629&DB=EPODOC&CC=WO&NR=2006069348A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROBERTS, RICK, J</creatorcontrib><creatorcontrib>ISHIKAWA, TETSUYA</creatorcontrib><title>COAT/DEVELOP MODULE WITH SHARED DISPENSE</title><description>An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
Cette invention concerne un dispositif de distribution de fluide au cours d'opérations de traitement sur un substrat semi-conducteur. Le dispositif comprend un banc central de distribution de fluide comprenant une pluralité de buses reliées à une pluralité de sources de fluide et une première chambre de traitement disposée sur un premier côté dudit banc. Le dispositif comprend également une seconde chambre de distribution disposée sur un second côté de ce même banc et un bras de distribution conçu pour se déplacer entre le banc central de distribution de fluide, la première chambre de traitement et la seconde chambre de traitement.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBw9ncM0XdxDXP18Q9Q8PV3CfVxVQj3DPFQCPZwDHJ1UXDxDA5w9Qt25WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYGZgZmlsYmFo5GxsSpAgCU4yUG</recordid><startdate>20060629</startdate><enddate>20060629</enddate><creator>ROBERTS, RICK, J</creator><creator>ISHIKAWA, TETSUYA</creator><scope>EVB</scope></search><sort><creationdate>20060629</creationdate><title>COAT/DEVELOP MODULE WITH SHARED DISPENSE</title><author>ROBERTS, RICK, J ; ISHIKAWA, TETSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2006069348A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2006</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ROBERTS, RICK, J</creatorcontrib><creatorcontrib>ISHIKAWA, TETSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROBERTS, RICK, J</au><au>ISHIKAWA, TETSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COAT/DEVELOP MODULE WITH SHARED DISPENSE</title><date>2006-06-29</date><risdate>2006</risdate><abstract>An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
Cette invention concerne un dispositif de distribution de fluide au cours d'opérations de traitement sur un substrat semi-conducteur. Le dispositif comprend un banc central de distribution de fluide comprenant une pluralité de buses reliées à une pluralité de sources de fluide et une première chambre de traitement disposée sur un premier côté dudit banc. Le dispositif comprend également une seconde chambre de distribution disposée sur un second côté de ce même banc et un bras de distribution conçu pour se déplacer entre le banc central de distribution de fluide, la première chambre de traitement et la seconde chambre de traitement.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | COAT/DEVELOP MODULE WITH SHARED DISPENSE |
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