TECHNIQUE FOR RECUDING BAKCSIDE PARTICLES

A technique for reducing backside particles is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for reducing backside particles. The apparatus may comprise a delivery mechanism configured to supply a cleaning substance to a platen, wherein the platen i...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	DANIELS, KEVIN, MICHAEL, FICARRA, LAWRENCE, RIAF, ARTHUR, PAUL, STARKS, KENNETH, L, SUURONEN, DAVID, EDWIN, BUCCOS, PAUL, STEPHEN, MURPHY, PAUL, J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING CLEANING IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A technique for reducing backside particles is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for reducing backside particles. The apparatus may comprise a delivery mechanism configured to supply a cleaning substance to a platen, wherein the platen is housed in a process chamber. The apparatus may also comprise a control unit configured to cause the process chamber to reach a first pressure level, cause the cleaning substance to be supplied to a surface of the platen, and cause the process chamber to reach a second pressure level, thereby removing contaminant particles, together with the cleaning substance, from the surface of the platen. La présente invention se rapporte à une technique permettant de réduire la quantité de particules sur l'envers d'une plaquette. Dans un mode de réalisation exemplaire, l'invention concerne un appareil permettant de réduire la quantité de particules sur l'envers d'une plaquette. L'appareil selon l'invention peut comprendre un mécanisme d'alimentation, adapté pour fournir une substance de nettoyage à une platine logée dans une chambre de traitement. L'appareil peut également comporter une unité de commande, adaptée pour permettre que la chambre de traitement atteigne un premier niveau de pression, que la substance de nettoyage soit fournie à la surface de la platine, et que la chambre de traitement atteigne un second niveau de pression, ce qui élimine les particules contaminantes, ainsi que la substance de nettoyage, de la surface de la platine.