SUBSTRATE TEMPERATURE CONTROL FOR COMBUSTION CHEMICAL VAPOR DEPOSITION

Method for depositing film on flexible (plastic/metal) foil and/or temperature sensitive substrates (101) by combustion chemical vapor deposition (C-CVD). A substrate (101) is held in place by suction to provide physical and thermal contact between the substrate (101) and a substrate holder (102) an...

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Bibliographische Detailangaben
Hauptverfasser:	MAESSEN, RALPH, T., H, AMMERLAAN, JOHANNES, A., M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Method for depositing film on flexible (plastic/metal) foil and/or temperature sensitive substrates (101) by combustion chemical vapor deposition (C-CVD). A substrate (101) is held in place by suction to provide physical and thermal contact between the substrate (101) and a substrate holder (102) and, simultaneously, the substrate holder (102) is cooled using a cooling fluid and the substrate (101). Heating of the substrate (101) during C-CVD is controlled and deterioration by heating is avoided. The foil or substrate (101) is suitable, in particular, for use in flat and flexible displays. L'invention concerne un procédé permettant de déposer un film sur une feuille (plastique/métallique) flexible et/ou des substrats (101) sensibles à la température par dépôt chimique en phase vapeur par combustion (C-CVD). Le procédé comporte les étapes consistant à: maintenir en place par aspiration un substrat (101) de manière à assurer un contact physique et thermique entre le substrat (101) et un support (102) de substrat; et refroidir simultanément le support (102) de substrat à l'aide d'un fluide de refroidissement et du substrat (101). Le chauffage du substrat (101) pendant le dépôt chimique en phase vapeur par combustion est réglé de manière à éviter toute détérioration due au chauffage. La feuille ou le substrat (101) s'utilise en particulier dans les écrans plats et flexibles.