THERMOSETTING RESIN COMPOSITION, THERMOSETTING FILM, CURED PRODUCT OF THOSE, AND ELECTRONIC COMPONENT

Disclosed is a thermosetting resin composition containing an epoxy resin (A), a diene-based crosslinked rubber (B) wherein the amount of bonded acrylonitrile is less than 10% by weight, a curing agent (D) and/or a curing catalyst (E). A cured product obtained by curing such a thermosetting resin com...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHIOKA, TAKASHI, GOTOU, HIROFUMI, IWANAGA, SHIN-ICHIRO, MIYATA, TSUNEMITSU
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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