DOUBLE-SIDED CHIP CARD MODULE WITH SINGLE-SIDE TESTING CAPABILITIES

The chip card module, when in an intermediate condition, comprises: a double-sided dielectric layer (10) with conductive patterns formed on both sides; a chip (12) supported on the backside (14) of said dielectric layer; first contact pads (20) arranged on the frontside (16) of said dielectric layer...

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Bibliographische Detailangaben
Hauptverfasser: REIGNOUX, YVES, DELOCHE, MANUEL, NEROT, DOROTHEE, THEVENOT, BENOIT, GROENINCK, DENIS, BREL, MARIE-CECILE
Format: Patent
Sprache:eng ; fre
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