METHOD FOR REDUCING METAL OXIDE POWDER AND ATTACHING IT TO A HEAT TRANSFER SURFACE AND THE HEAT TRANSFER SURFACE

The purpose of the method developed is to form on top of a heat transfer surface a porous surface layer, which is to be fixed to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy. The powder forming a porous surfa...

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Bibliographische Detailangaben
Hauptverfasser:	LAAKSONEN, OLLI, RISSANEN, PETRI
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BLASTING CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION DIFFUSION TREATMENT OF METALLIC MATERIAL HEAT EXCHANGE IN GENERAL HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The purpose of the method developed is to form on top of a heat transfer surface a porous surface layer, which is to be fixed to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy. The powder forming a porous surface is fine-grained copper oxide powder, which is reduced to metallic copper on the heat transfer surface during heat treatment. The invention also relates to the heat transfer surface of copper or copper alloy, on which a porous layer has been formed from metallic copper, which is manufactured by reducing copper oxide powder and is attached using brazing solder. The purpose of the method developed is to form on top of a heat transfer surface a porous surface layer, which is to be fixed to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy. The powder forming a porous surface is fine-grained copper oxide powder, which is reduced to metallic copper on the heat transfer surface during heat treatment. The invention also relates to the heat transfer surface of copper or copper alloy, on which a porous layer has been formed from metallic copper, which is manufactured by reducing copper oxide powder and is attached using brazing solder. Le but du procédé développé consiste à former au sommet d'une surface de transfert thermique une couche de surface poreuse, qui doit être fixée en dessous de la surface à une température et en un temps applicables pour une fabrication industrielle. La surface de transfert thermique est du cuivre ou un alliage de cuivre. La poudre formant une surface poreuse est une poudre d'oxyde de cuivre à grains fins qui est réduite en cuivre métallique sur la surface de transfert thermique pendant un traitement thermique. L'invention se rapporte également à la surface de transfert thermique de cuivre ou d'alliage de cuivre sur lequel une couche poreuse a été formée à partir de cuivre métallique, laquelle est fabriquée en réduisant la poudre d'oxyde de cuivre et est fixée en utilisant une soudure de brasage.