METHOD FOR ATTACHING METAL POWDER TO A HEAT TRANSFER SURFACE AND THE HEAT TRANSFER SURFACE

The purpose of the method developed is to form on top of a heat transfer surface a porous layer, which is to be fixed strongly to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy, preferably oxygen-free or deoxid...

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Bibliographische Detailangaben
Hauptverfasser: LAAKSONEN, OLLI, RISSANEN, PETRI
Format: Patent
Sprache:eng ; fre
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Beschreibung
Zusammenfassung:The purpose of the method developed is to form on top of a heat transfer surface a porous layer, which is to be fixed strongly to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy, preferably oxygen-free or deoxidised high phosphorous copper. The powder forming a porous surface is fine-grained copper powder or copper alloy powder. In the method according to the invention, a brazing solder containing preferably nickel, tin and phosphorous alloyed with copper, is brought to the heat transfer surface. The invention also relates to the heat transfer surface onto which a porous surface is formed by means of a powder of copper or copper alloy and the brazing solder described. The purpose of the method developed is to form on top of a heat transfer surface a porous layer, which is to be fixed strongly to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy, preferably oxygen-free or deoxidised high phosphorous copper. The powder forming a porous surface is fine-grained copper powder or copper alloy powder. In the method according to the invention, a brazing solder containing preferably nickel, tin and phosphorous alloyed with copper, is brought to the heat transfer surface. The invention also relates to the heat transfer surface onto which a porous surface is formed by means of a powder of copper or copper alloy and the brazing solder described. L'objet du procédé développé est de former une couche poreuse au-dessus d'une surface de transfert de la chaleur, laquelle couche est à fixer solidement sur la surface en dessous à une température et à un moment pouvant être appliqués à la fabrication industrielle. La surface de transfert de la chaleur est en cuivre et alliage de cuivre, de préférence du cuivre dépourvu d'oxygène ou désoxydé à forte teneur en phosphore. La poudre formant la surface poreuse est une poudre de cuivre à grain fin ou une poudre d'alliage de cuivre. Dans le procédé selon l'invention, une brasure contenant de préférence du nickel, de l'étain et du phosphore alliés à du cuivre, est amenée à la surface de transfert de la chaleur. L'invention concerne également la surface de transfert de la chaleur sur laquelle se forme une surface poreuse au moyen d'une poudre de cuivre ou d'alliage de cuivre et la brasure décrite.