STRUCTURALLY REINFORCED RESINOUS ARTICLE AND METHOD OF MAKING

A process for forming a shaped, multilayer article comprises heating a reinforced resinous substrate to a thermoforming temperature to form a heated substrate; contacting a surface of the heated substrate with a surface of shaped surface component, wherein the heated substrate has a sufficient conce...

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Bibliographische Detailangaben
Hauptverfasser:	DAVIS, SCOTT, MICHAEL, DUNTON, THOMAS, PAUL, MYERS, RANDALL, TODD
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A process for forming a shaped, multilayer article comprises heating a reinforced resinous substrate to a thermoforming temperature to form a heated substrate; contacting a surface of the heated substrate with a surface of shaped surface component, wherein the heated substrate has a sufficient concentration of heated resin at the surface thereof for bonding the heated substrate to the shaped surface component; and thermoforming the heated substrate at a pressure less than or equal to about 500 psi (3447 kPa) to provide a bond at an interface between the surface of the thermoformed substrate and the surface of the shaped surface component. L'invention concerne un procédé de fabrication d'un article multicouche profilé. Ce procédé consiste : à chauffer un substrat résineux renforcé à une température de thermoformage afin de former un substrat chauffé ; à mettre en contact une surface du substrat chauffé avec une surface d'un composant profilé, le substrat chauffé comportant une concentration de résine chauffée suffisante sur sa surface pour le faire adhérer au composant profilé ; et à thermoformer le substrat chauffé à une pression inférieure ou égale à environ 500 psi (3447 kPa), de sorte à obtenir une zone d'adhérence au niveau de l'interface entre la surface du substrat thermoformé et la surface du composant profilé.