SAW SINGULATION

Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	VAN GEMERT, LEO, KHOR, TEANG, K, DONKER, MARCUS, FRANCISCUS, MIHAI, CHRIS
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BROACHING COMPONENTS OR ACCESSORIES THEREFOR DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR NAILING OR STAPLING MACHINES IN GENERAL PERFORMING OPERATIONS PLANING POLISHING SAWING SAWS FOR WOOD OR SIMILAR MATERIAL SCRAPING SHEARING SLOTTING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides better fluid flow over the cutting blades. Another aspect of the invention corresponds to a nozzle adjustment assembly that helps position the nozzles relative to the blades. Another aspect of the invention corresponds to spacers that reduce the problem of imbalance caused by fluid retained therein. Yet another aspect pertains to the composition of the fluid, which is distributed by the nozzle assembly to the blades. L'invention porte sur des systèmes et procédés améliorés de découpage d'un substrat en plusieurs éléments de circuits intégrés, et en particulier: sur un support maintenant le substrat pendant la processus de découpage des dés; sur un ensemble de buses répartissant mieux le liquide de coupe sur les lames; sur un ensemble de réglage des buses aidant à les positionner par rapport aux lames; sur des espaceurs réduisant les problèmes de déséquilibrage causés par le liquide y étant retenu; et sur la composition du liquide de coupe réparti par les buses sur les lames.