LASER ABLATION RESISTANT COPPER FOIL

A copper foil (96) for lamination to a dielectric substrate (92) is coated with a laser ablation inhibiting layer (100) having an average surface roughness (RZ) of less than 1.0 micron and an average nodule height of less than 1.2 micron that is effective to provide a lamination peel strength to FR-...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHESKIS, HARVEY, P, BRENNEMAN, WILLIAM, L, CHEN, SZUCHAIN, F
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	A copper foil (96) for lamination to a dielectric substrate (92) is coated with a laser ablation inhibiting layer (100) having an average surface roughness (RZ) of less than 1.0 micron and an average nodule height of less than 1.2 micron that is effective to provide a lamination peel strength to FR-4 of at least 80.4 grams per millimeter (4.5 pounds per inch). The coated foil (96) further has a reflectivity value of at least 40. The coated foil (96) is typically laminated to a dielectric substrate (92), such as glass reinforced epoxy or polyimide and imaged into a plurality of circuit traces. Blind vias (98) may be drilled through the dielectric (92) terminating at an interface between the foil (96) and the dielectric (92). The coated foil (96) of the invention resists laser ablation, thereby resisting piercing (102) of the foil (96) by the laser during drilling. L'invention porte sur une feuille de cuivre (96) à laminer sur un substrat diélectrique (92), qui est revêtue d'une couche d'inhibition d'ablation au laser (100) présentant une rugosité de surface moyenne (RZ) inférieure à 1,0 micron et une hauteur de nodule inférieure à 1,2 micron, et qui permet de fournir une force de détachement de laminage à FR-4 d'au moins 80,4 grammes par millimètre (4,5 livres par pouce). La feuille revêtue (96) présente également une valeur de réflexion d'au moins 40. Cette feuille revêtue (96) est généralement laminée sur un substrat diélectrique (92), tel de l'époxy ou du polyimide renforcé en verre et imagée en plusieurs pistes de circuit. Des trous borgnes (98) peuvent être percés à travers le diélectrique (92) qui se termine au niveau d'une interface entre la feuille (96) et le diélectrique (92). La feuille revêtue (96) résiste à l'ablation au laser, ce qui lui permet de résister au perçage (102) de la feuille (96) par le laser au cours du perçage.