HIGH INTEGRITY SPUTTERING TARGET MATERIAL AND METHOD FOR PRODUCING BULK QUANTITIES OF SAME
A method of making metal plates as well as sputtering targets is described. In addition, products made by the process of the present invention are further described. The present invention preferably provides a product with reduced or minimized marbleizing on the surface of the metal product which ha...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | A method of making metal plates as well as sputtering targets is described. In addition, products made by the process of the present invention are further described. The present invention preferably provides a product with reduced or minimized marbleizing on the surface of the metal product which has a multitude of benefits.
La présente invention a trait à un procédé de fabrication de plaques métalliques ainsi qu'à des cibles de pulvérisation cathodique. L'invention a également trait à des produits fabriqués par le procédé de la présente invention. De préférence, la présente invention a trait à un produit à marbrage de surface réduit ou minimisé du produit métallique offrant plusieurs avantages. |
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