METHODS AND APPARATUS FOR LASER DICING

An apparatus and method of dicing a microelectronic device wafer by laser ablating at least an interconnected layer portion of the microelectronic device wafer in the presence of an anion plasma, wherein the anion plasma reacts with debris from the laser ablation to form a reaction gas. Dispositif e...

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Bibliographische Detailangaben
Hauptverfasser:	MULLIGAN, ROSE, SHARON, SUJIT
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus and method of dicing a microelectronic device wafer by laser ablating at least an interconnected layer portion of the microelectronic device wafer in the presence of an anion plasma, wherein the anion plasma reacts with debris from the laser ablation to form a reaction gas. Dispositif et procédé de quadrillage d'une tranche pour dispositif micro-électronique consistant à retirer par ablation laser au moins une partie d'une couche d'interconnexion de ladite tranche en présence d'un plasma anionique, ledit plasma réagissant avec les débris produits par l'ablation laser pour former un gaz de réaction.