METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF

An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (42, 64) over a mold encapsulant (35, 62). The conductive layer (42, 64) may be electrically coupled using a wire to the leadframe (10, 52) of the semiconductor package (2, 50). The...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHAPMAN, MICHAEL, E, MAHADEVAN, DAVE, S, SALIAN, ARVIND, S
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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