LEADFRAME WITH INSULATING RING
A leadframe (4) comprises a die mounting area (3), a plurality of lead fingers (6) and an insulating ring (5). The insulating ring (5) is formed directly onto the leadframe (4) by a moulding process. Cette invention concerne une grille de connexion (4) comprenant une zone de montage de puce (3), une...
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| creator | BUN HIN, KEONG |
| description | A leadframe (4) comprises a die mounting area (3), a plurality of lead fingers (6) and an insulating ring (5). The insulating ring (5) is formed directly onto the leadframe (4) by a moulding process.
Cette invention concerne une grille de connexion (4) comprenant une zone de montage de puce (3), une pluralité de pattes de connexion (6) et un anneau isolant (5). L'anneau isolant (5) est formé directement sur la grille de connexion (4) au moyen d'un procédé de moulage. |
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Cette invention concerne une grille de connexion (4) comprenant une zone de montage de puce (3), une pluralité de pattes de connexion (6) et un anneau isolant (5). L'anneau isolant (5) est formé directement sur la grille de connexion (4) au moyen d'un procédé de moulage.</description><edition>7</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050519&DB=EPODOC&CC=WO&NR=2005045930A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050519&DB=EPODOC&CC=WO&NR=2005045930A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BUN HIN, KEONG</creatorcontrib><title>LEADFRAME WITH INSULATING RING</title><description>A leadframe (4) comprises a die mounting area (3), a plurality of lead fingers (6) and an insulating ring (5). The insulating ring (5) is formed directly onto the leadframe (4) by a moulding process.
Cette invention concerne une grille de connexion (4) comprenant une zone de montage de puce (3), une pluralité de pattes de connexion (6) et un anneau isolant (5). L'anneau isolant (5) est formé directement sur la grille de connexion (4) au moyen d'un procédé de moulage.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDzcXV0cQty9HVVCPcM8VDw9AsO9XEM8fRzVwgCEjwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JD7c38jAwNTAxNTS2MDR0Jg4VQA06SI4</recordid><startdate>20050519</startdate><enddate>20050519</enddate><creator>BUN HIN, KEONG</creator><scope>EVB</scope></search><sort><creationdate>20050519</creationdate><title>LEADFRAME WITH INSULATING RING</title><author>BUN HIN, KEONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2005045930A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BUN HIN, KEONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BUN HIN, KEONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEADFRAME WITH INSULATING RING</title><date>2005-05-19</date><risdate>2005</risdate><abstract>A leadframe (4) comprises a die mounting area (3), a plurality of lead fingers (6) and an insulating ring (5). The insulating ring (5) is formed directly onto the leadframe (4) by a moulding process.
Cette invention concerne une grille de connexion (4) comprenant une zone de montage de puce (3), une pluralité de pattes de connexion (6) et un anneau isolant (5). L'anneau isolant (5) est formé directement sur la grille de connexion (4) au moyen d'un procédé de moulage.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | LEADFRAME WITH INSULATING RING |
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