METHOD OF LACQUERING SEMICONDUCTOR SUBSTRATES

The invention provides a method of lacquering substrates, in particular semiconductor substrates, whose surfaces have three-dimensional topographies. For this purpose, the substrate is sprayed with a lacquer that is modified with a solvent, and subsequently the applied lacquer layer is homogenized i...

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Bibliographische Detailangaben
1. Verfasser: HOEPPNER, JUERGEN
Format: Patent
Sprache:eng ; fre
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