COMPOSITION AND METHOD RELATING TO A HOT MELT ADHESIVE

The present invention includes methods and compositions relating to a hot melt adhesive that includes ethylene methyl methacrylate and a tackifying resin. La présente invention concerne des procédés et des compositions associés à un adhésif thermofusible comprenant un méthacrylate d'éthylène mé...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI, KAZUYA, ROSKA, TIMOTHY, W, MALCOLM, DAVID, B, COLEMAN, KATHRYN, A, ALBRECHT, STEVEN, W
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention includes methods and compositions relating to a hot melt adhesive that includes ethylene methyl methacrylate and a tackifying resin. La présente invention concerne des procédés et des compositions associés à un adhésif thermofusible comprenant un méthacrylate d'éthylène méthyle et une résine donnant du collant.