A METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESSING

A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool (200), comprises placing the wafer into a first segment (10) of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber (6) and a factor...

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Bibliographische Detailangaben
Hauptverfasser:	DULMAGE, LAURENCE, KELLER, JED, PRICE, J.B
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool (200), comprises placing the wafer into a first segment (10) of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber (6) and a factory interface (8). The wafer is transported to a second segment (10) of the vacuum enclosure using a vertical transport mechanism (2), wherein the second segment is above or below the first segment. La présente invention a trait à un procédé et un appareil pour le traitement de semi-conducteurs. Dans un mode de réalisation, l'invention a trait à un procédé de transport d'une tranche au sein d'un outil à étages, comportant le placement de la tranche dans un premier segment d'une enceinte sous vide, l'enceinte sous vide étant fixé à une chambre de traitement et une interface de production. La tranche est transportée vers un deuxième segment de l'enceinte sous vide au moyen d'un mécanisme de transport vertical, le deuxième segment se trouvant au-dessus ou au-dessous du premier segment.