METHOD FOR FORMING A WAFER FOR USE IN AN OPTICAL PART AND AN OPTICAL PART INCORPORATING SUCH A WAFER

An improved method is disclosed, for forming a wafer into a complex, curved shape, for use in an optical part. The method includes a step of moving the wafer into contact with a molding surface having a predetermined non-­cylindrical, aspheric curved shape, to form the wafer into a corresponding sha...

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Bibliographische Detailangaben
Hauptverfasser: SIDHU, JOTINDERPAL, BALCH, THOMAS, A
Format: Patent
Sprache:eng ; fre
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