POLISHING COMPOSITIONS AND METHOD OF USE
This invention relates generally to compositions and methods for removing adherent materials and polishing surfaces. In one embodiment, the method employs an improved media comprising core-shell particles. The media can be applied to microelectronic objects of manufacture. L'invention se rappor...
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| creator | SMITH, DENNIS, EDWARD BABU, SURYADEVARA, V |
| description | This invention relates generally to compositions and methods for removing adherent materials and polishing surfaces. In one embodiment, the method employs an improved media comprising core-shell particles. The media can be applied to microelectronic objects of manufacture.
L'invention se rapporte en règle générale à des compositions et à des procédés permettant de retirer des matières adhérentes et à des surfaces de polissage. Dans un mode de réalisation, le procédé utilise un support amélioré comprenant des particules coeur-écorce. Le support peut être appliqué sur des objets micro-électroniques de fabrication. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2004092298A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2004092298A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2004092298A23</originalsourceid><addsrcrecordid>eNrjZNAI8PfxDPbw9HNXcPb3DfAP9gzx9PcLVnD0c1HwdQ3x8HdR8HdTCA125WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYGJgaWRkaWFo5GxsSpAgCh2iUT</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING COMPOSITIONS AND METHOD OF USE</title><source>esp@cenet</source><creator>SMITH, DENNIS, EDWARD ; BABU, SURYADEVARA, V</creator><creatorcontrib>SMITH, DENNIS, EDWARD ; BABU, SURYADEVARA, V</creatorcontrib><description>This invention relates generally to compositions and methods for removing adherent materials and polishing surfaces. In one embodiment, the method employs an improved media comprising core-shell particles. The media can be applied to microelectronic objects of manufacture.
L'invention se rapporte en règle générale à des compositions et à des procédés permettant de retirer des matières adhérentes et à des surfaces de polissage. Dans un mode de réalisation, le procédé utilise un support amélioré comprenant des particules coeur-écorce. Le support peut être appliqué sur des objets micro-électroniques de fabrication.</description><edition>7</edition><language>eng ; fre</language><subject>ADHESIVES ; CHEMISTRY ; DYES ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; SKI WAXES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041028&DB=EPODOC&CC=WO&NR=2004092298A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041028&DB=EPODOC&CC=WO&NR=2004092298A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SMITH, DENNIS, EDWARD</creatorcontrib><creatorcontrib>BABU, SURYADEVARA, V</creatorcontrib><title>POLISHING COMPOSITIONS AND METHOD OF USE</title><description>This invention relates generally to compositions and methods for removing adherent materials and polishing surfaces. In one embodiment, the method employs an improved media comprising core-shell particles. The media can be applied to microelectronic objects of manufacture.
L'invention se rapporte en règle générale à des compositions et à des procédés permettant de retirer des matières adhérentes et à des surfaces de polissage. Dans un mode de réalisation, le procédé utilise un support amélioré comprenant des particules coeur-écorce. Le support peut être appliqué sur des objets micro-électroniques de fabrication.</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>SKI WAXES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAI8PfxDPbw9HNXcPb3DfAP9gzx9PcLVnD0c1HwdQ3x8HdR8HdTCA125WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYGJgaWRkaWFo5GxsSpAgCh2iUT</recordid><startdate>20041028</startdate><enddate>20041028</enddate><creator>SMITH, DENNIS, EDWARD</creator><creator>BABU, SURYADEVARA, V</creator><scope>EVB</scope></search><sort><creationdate>20041028</creationdate><title>POLISHING COMPOSITIONS AND METHOD OF USE</title><author>SMITH, DENNIS, EDWARD ; BABU, SURYADEVARA, V</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2004092298A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2004</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>SKI WAXES</topic><toplevel>online_resources</toplevel><creatorcontrib>SMITH, DENNIS, EDWARD</creatorcontrib><creatorcontrib>BABU, SURYADEVARA, V</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SMITH, DENNIS, EDWARD</au><au>BABU, SURYADEVARA, V</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING COMPOSITIONS AND METHOD OF USE</title><date>2004-10-28</date><risdate>2004</risdate><abstract>This invention relates generally to compositions and methods for removing adherent materials and polishing surfaces. In one embodiment, the method employs an improved media comprising core-shell particles. The media can be applied to microelectronic objects of manufacture.
L'invention se rapporte en règle générale à des compositions et à des procédés permettant de retirer des matières adhérentes et à des surfaces de polissage. Dans un mode de réalisation, le procédé utilise un support amélioré comprenant des particules coeur-écorce. Le support peut être appliqué sur des objets micro-électroniques de fabrication.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES |
| title | POLISHING COMPOSITIONS AND METHOD OF USE |
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