MEMS CONTROL CHIP INTEGRATION

An exemplary method and apparatus for MEMS device control-chip integration and packaging comprises inter alia: a device substrate (300) comprising at least one MEMS device element (315) and at least a first interconnect pad (350); and a control-chip lid substrate (460) comprising at least a second i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MARKGRAF, STEVEN, SILVA, ANANDA, P, SPRINGER, STEPHEN, B, DENTON, HEIDI, AMRINE, CRAIG, FREAR, DARREL, KUO, SHUN-MEEN, FOERSTNER, JUERGEN, A, HUGHES, HENRY, G
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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