CURABLE EPOXY COMPOSITIONS, METHODS AND ARTICLES MADE THEREFROM

A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica, cure catalyst, and optional reagents. Further embodiments of the present invention include a method for making the epoxy formulation and a semicondu...

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Bibliographische Detailangaben
Hauptverfasser:	SHERMAN, DONNA, MARIE, TONAPI, SANDEEP, RUBINSZTAJN, SLAWOMIR, PRABHAKUMAR, ANANTH
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica, cure catalyst, and optional reagents. Further embodiments of the present invention include a method for making the epoxy formulation and a semiconductor package comprising the curable epoxy formulation. L'invention concerne une formulation époxy durcissable comprenant un monomère époxy, une silice colloïdale organo-fonctionnalisée, un catalyseur de durcissement et des réactifs facultatifs. D'autres modes de réalisation de l'invention concernent un procédé de préparation de la formulation époxy durcissable et un boîtier semi-conducteur comprenant la formulation époxy durcissable.