METHOD AND APPARATUS FOR ADHESIVE JOINT SEPARATION
Devices and methods for cutting an adhesively bonded joint (110), premised upon providing a joint (110) that includes an adhesive, a first component and a second component are part of the present invention. The cutting of the adhesive (110) may be by a cutter including a cutting portion (112) that i...
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Sprache: | eng ; fre |
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Zusammenfassung: | Devices and methods for cutting an adhesively bonded joint (110), premised upon providing a joint (110) that includes an adhesive, a first component and a second component are part of the present invention. The cutting of the adhesive (110) may be by a cutter including a cutting portion (112) that is advanced about at least a portion of the periphery of the joint by an advancing mechanism (122). Kits for repairing and/or replacing components that include an adhesively bonded joint are also contemplated.
L'invention concerne des dispositifs et des procédés pour coupe un joint collé (110) de manière adhésive. Selon l'invention, un joint (110) comprend un adhésif, un premier composant et un second composant. La section de l'adhésif (110) peut être effectuée par un dispositif de coupe doté d'une partie coupante (112) qui fait saillie au moins sur une partie de la périphérie du joint à l'aide d'un mécanisme de progression (122). L'invention concerne également des kits de réparation et/ou de remplacement des composants comprenant ledit joint collé de manière adhésive. |
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