THERMAL TRANSFER DEVICES USING HEAT PIPES

The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a composition which includes a polymer base matrix having a thermally cond...

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Bibliographische Detailangaben
Hauptverfasser:	FLINT, JAMES, PATRICK, DEAN, NANCY, F
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a composition which includes a polymer base matrix having a thermally conductive filler material dispersed therein. The housing can have a thermal conductivity of at least about 10 W/mK. The device can include a wick comprising woven carbon fibers. L'invention porte sur un dispositif de transfert thermique comportant un boîtier comportant au moins une partie de chambre isolée de l'atmosphère, et remplie d'un fluide de travail. Le boîtier peut être fait d'une composition comprenant une matrice à base de polymère dans laquelle est dispersée une charge thermoconductrice qui confère au boîtier une conductivité thermique d'au moins environ 10 W/mK. Le dispositif peur comporter une mèche de fibres tissées de carbone.