ENCAPSULATED INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE

In one aspect, the present invention features a method of manufacturing an integrated circuit package including providing a substrate having a first surface, a second surface opposite the first surface, a cavity through the substrate between the first and second surfaces and a conductive via extendi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEUNG, TSANG, KWOK, KEUNG, CHOW, LAP, FAN, CHUN, HO, COMBS, EDWARD, G, MCLELLAN, NEIL, ROBERT, LABEEB, SADAK, THAMBY
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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